I was going to say much the same thing as Jean-Paul (only less eloquently)
having read the first few posts There are two obvious possible causes here:
(1) the use of lead-free solder
(2) poor design for reliability, failing to account for thermo-mechanical aspects
Given this is a first mass-produced product for Microsoft (a computer software
company with no track-record in similar hardware on the world market) I know
which one I would be more inclined to point the finger at. The other is
probably a contributing factor, at least in as far as a full and proper
understanding of its performance and the manufacturing process controls
necessary to guarantee the required level of performance for the design.
Nigel Burtt
Enjaybee Associates
www.nigelburtt.co.uk
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