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January 2010

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Tue, 19 Jan 2010 16:31:20 -0500
Content-Type:
text/plain
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text/plain (143 lines)
 Denny,
Woah—the "engineering is done?!?"—not by a long shot.
There are no scientific reasons or other valid reasons to keep Pb-free. What do you get that is not better with SnPb? What Pb-free performance is worth the extra cost, not to say anything about the environmental damage.
Sure, it provides a lot of research grant money and work for consultants, but a bad idea is a bad idea.
Werner

 


 

 

-----Original Message-----
From: Dennis Fritz <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Jan 19, 2010 3:43 pm
Subject: Re: [LF] Fodder for Discussion?


Let me pose the same question I did recently in the aerospace/defense community 
- 

"Now that cellphone and laptop manufacturers have been exposed/adopted lead-free 
solder, would they go back to leaded solder"?  

I maintain that now that the engineering is done to learn lead-free, there are 
scientific reasons to keep many products lead-free.  Do you agree that even 
though lead-free costs more per gram, there are electronics constructions where 
lead-free is worth the extra cost, based on performance?

More fodder. 

Denny Fritz
SAIC, Inc






-----Original Message-----
From: Marcus L. Thompson <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Jan 19, 2010 3:30 pm
Subject: Re: [LF] Fodder for Discussion?


"In my practice, over the last 15 years, the most frequent type of failures has 
been SnPb creep failures in single-sided through-hole joints." 
 
Thank you, Jean-Paul, for weighing in here. I do not doubt your experience. 
 
However, assuming anything near commonsense design and proper assembly 
techniques, I've never experienced nor heard of any such problem with Sn/Pb. 
 
Perhaps one could say that, on balance, issues such as this were quite rare 
before we had been informed of the evils of lead? 
 
Thanks again -- 
 
 
--- Previous Message in This Thread --- 
Subject: Re:[LF] Fodder for Discussion? 
From: Jean-Paul Clech <[log in to unmask]> 
To: [log in to unmask] 
Date: Tuesday, January 19, 2010 11:57:13 AM 
 
> > > Search for GPU failures and you will find that SnPb solder joints have > 
failed recently aswell, in areas where SnPb products are still sold (including > 
North America). 
> > A few years ago (~5-7 years ago), a Danish consumer organization had a > 
technical report on the internet, showing laptop SnPb solder joint > 
creep/fatigue failures after < 2-3 years of use. In my practice, over the last 
15 > years, the most frequent type of failures has been SnPb creep failures in > 
single-sided through-hole joints. I am sure that Werner can add to the list. > 
Unfortunately, the parties involved are reluctant to publish. 
> > In many of these cases, SnPb or lead-free, the main issue is a lack of > 
design-for-reliability (e.g. detrimental effect of stiff leads, large > 
temperature swings in use, poor choice of materials etc...). These issues will > 
stay, regardless of solder compositions. No doubt that the problem has been > 
compounded by the introduction of new (often uncharacterized) alloys. 
> > Best, 
> Jean-Paul 
> > > In a message dated 1/19/2010 2:01:30 P.M. Eastern Standard Time, > 
[log in to unmask] writes: 
> > You think the Xbox issue is the only one; laptop failures are a real issue > 
as well. 
> > > > > > > > Quote of the month (not necessarily monthly): > "Quality means 
doing it right when no one is looking", Henry Ford. 
> _______________________________________________ 
> Jean-Paul Clech 
> EPSI Inc. -- There is no short cut to reliability. 
> P.O. Box 1522, Montclair, NJ 07042, USA 
> tel. & fax:+1 (973)746-3796 
> _http://www.jpclech.com_ (http://www.jpclech.com/) > > -------------------------------------------------------------------------------Leadfee 
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