I suppose it would depend upon how you would go about defining
"performance" in this context.
More fodder, indeed ;o)
--- Previous Message in This Thread ---
Subject: Re:[LF] Fodder for Discussion?
From: Dennis Fritz <[log in to unmask]>
To: [log in to unmask]
Date: Tuesday, January 19, 2010 12:43:13 PM
> Let me pose the same question I did recently in the aerospace/defense community -
>
> "Now that cellphone and laptop manufacturers have been exposed/adopted lead-free solder, would they go back to leaded solder"?
>
> I maintain that now that the engineering is done to learn lead-free, there are scientific reasons to keep many products lead-free. Do you agree that even though lead-free costs more per gram, there are electronics constructions where lead-free is worth the extra cost, based on performance?
>
> More fodder.
>
> Denny Fritz
> SAIC, Inc
>
>
>
>
>
>
> -----Original Message-----
> From: Marcus L. Thompson <[log in to unmask]>
> To: [log in to unmask]
> Sent: Tue, Jan 19, 2010 3:30 pm
> Subject: Re: [LF] Fodder for Discussion?
>
>
> "In my practice, over the last 15 years, the most frequent type of failures has been SnPb creep failures in single-sided through-hole joints."
>
> Thank you, Jean-Paul, for weighing in here. I do not doubt your experience.
>
> However, assuming anything near commonsense design and proper assembly techniques, I've never experienced nor heard of any such problem with Sn/Pb.
>
> Perhaps one could say that, on balance, issues such as this were quite rare before we had been informed of the evils of lead?
>
> Thanks again --
>
>
> --- Previous Message in This Thread ---
> Subject: Re:[LF] Fodder for Discussion?
> From: Jean-Paul Clech <[log in to unmask]>
> To: [log in to unmask]
> Date: Tuesday, January 19, 2010 11:57:13 AM
>
>>>> Search for GPU failures and you will find that SnPb solder joints have > failed recently aswell, in areas where SnPb products are still sold (including > North America).
>>> A few years ago (~5-7 years ago), a Danish consumer organization had a > technical report on the internet, showing laptop SnPb solder joint > creep/fatigue failures after < 2-3 years of use. In my practice, over the last 15 > years, the most frequent type of failures has been SnPb creep failures in > single-sided through-hole joints. I am sure that Werner can add to the list. > Unfortunately, the parties involved are reluctant to publish.
>>> In many of these cases, SnPb or lead-free, the main issue is a lack of > design-for-reliability (e.g. detrimental effect of stiff leads, large > temperature swings in use, poor choice of materials etc...). These issues will > stay, regardless of solder compositions. No doubt that the problem has been > compounded by the introduction of new (often uncharacterized) alloys.
>>> Best,
>> Jean-Paul
>>>> In a message dated 1/19/2010 2:01:30 P.M. Eastern Standard Time, > [log in to unmask] writes:
>>> You think the Xbox issue is the only one; laptop failures are a real issue > as well.
>>>>>>>>> Quote of the month (not necessarily monthly): > "Quality means doing it right when no one is looking", Henry Ford.
>> _______________________________________________
>> Jean-Paul Clech
>> EPSI Inc. -- There is no short cut to reliability.
>> P.O. Box 1522, Montclair, NJ 07042, USA
>> tel. & fax:+1 (973)746-3796
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