If this is the result of the cross sectioning method then it would not
be a reject. (i.e. does it polish away) If however it is not, it would
not comply to the specification. Assuming all correct controls and
methods were used in the sample preparation.

Jim
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of John Perry
Sent: Thursday, January 28, 2010 7:35 PM
To: [log in to unmask]
Subject: [IPC-600-6012] Bundle Crack in Microsection

Hi Everyone,

We've got a request for feedback on the anomaly in the attached .ppt
file which was detected in one bundle of glass in a coupon.  This is in
the center of the board stack, which is a 24 layer construction.  Since
it is in the core material it may be related to glass non-wetting of the
resin or poor glass treatment.

I'd also like to know if this is something we can consider developing
criteria for in the next generation of IPC-6012/A-600 when we meet in
Las Vegas in a couple months.

Regards,

John Perry
Technical Project Manager
IPC - Association Connecting Electronics Industries(r)
3000 Lakeside Drive # 309S
Bannockburn, IL 60015-1249 USA
+1 847-597-2818 (tel)
+1 847-615-7105 (fax)
+1 847-615-7100 (Main)
[log in to unmask]
www.ipc.org



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