IPC-600-6012 Archives

January 2010

IPC-600-6012@IPC.ORG

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Subject:
From:
"Gandhi, Mahendra S (AS)" <[log in to unmask]>
Reply To:
(Combined Forum of D-33a and 7-31a Subcommittees)
Date:
Fri, 29 Jan 2010 08:38:18 -0600
Content-Type:
text/plain
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text/plain (43 lines)
Since it is in the center of a 24 layer board which can not be seen like
a measles (top surface), so measles criteria cannot be applied. It is in
the core - can this be a material related issue?

Mahendra Gandhi
M&P Engineer
Northrop Grumman Aerospace Systems
One Space Park, R6/2184A
Redondo Beach, Ca. 90278
Ph.: 310-813-6857
Fax: 310-812-8630
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-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of John Perry
Sent: Thursday, January 28, 2010 4:35 PM
To: [log in to unmask]
Subject: [IPC-600-6012] Bundle Crack in Microsection

Hi Everyone,

We've got a request for feedback on the anomaly in the attached .ppt
file which was detected in one bundle of glass in a coupon.  This is in
the center of the board stack, which is a 24 layer construction.  Since
it is in the core material it may be related to glass non-wetting of the
resin or poor glass treatment.

I'd also like to know if this is something we can consider developing
criteria for in the next generation of IPC-6012/A-600 when we meet in
Las Vegas in a couple months.

Regards,

John Perry
Technical Project Manager
IPC - Association Connecting Electronics Industries(r) 3000 Lakeside
Drive # 309S Bannockburn, IL 60015-1249 USA
+1 847-597-2818 (tel)
+1 847-615-7105 (fax)
+1 847-615-7100 (Main)
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