Subject: | |
From: | |
Reply To: | (Combined Forum of D-33a and 7-31a Subcommittees) |
Date: | Fri, 29 Jan 2010 08:38:18 -0600 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Since it is in the center of a 24 layer board which can not be seen like
a measles (top surface), so measles criteria cannot be applied. It is in
the core - can this be a material related issue?
Mahendra Gandhi
M&P Engineer
Northrop Grumman Aerospace Systems
One Space Park, R6/2184A
Redondo Beach, Ca. 90278
Ph.: 310-813-6857
Fax: 310-812-8630
[log in to unmask]
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of John Perry
Sent: Thursday, January 28, 2010 4:35 PM
To: [log in to unmask]
Subject: [IPC-600-6012] Bundle Crack in Microsection
Hi Everyone,
We've got a request for feedback on the anomaly in the attached .ppt
file which was detected in one bundle of glass in a coupon. This is in
the center of the board stack, which is a 24 layer construction. Since
it is in the core material it may be related to glass non-wetting of the
resin or poor glass treatment.
I'd also like to know if this is something we can consider developing
criteria for in the next generation of IPC-6012/A-600 when we meet in
Las Vegas in a couple months.
Regards,
John Perry
Technical Project Manager
IPC - Association Connecting Electronics Industries(r) 3000 Lakeside
Drive # 309S Bannockburn, IL 60015-1249 USA
+1 847-597-2818 (tel)
+1 847-615-7105 (fax)
+1 847-615-7100 (Main)
[log in to unmask]
www.ipc.org
|
|
|