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January 2010

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Subject:
From:
Jack Olson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jack Olson <[log in to unmask]>
Date:
Mon, 11 Jan 2010 13:28:28 -0600
Content-Type:
text/plain
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text/plain (34 lines)
If you are using vias for heat transfer,
you don't use thermal relief "spokes".
(via pads are flooded into the copper pours)

Jack

.

On Tue, 5 Jan 2010 10:31:02 -0500, Tontis, Theodore 
<[log in to unmask]> wrote:

>Bill,
>
>Do you know if that calculator can adjust the thermo relief used to attach 
the via to a plane? I would be interested to see if changing the number and or 
size of the spokes would have a greater impact then having it filled in with 
solder? I would also be interested to see how much more thermally conductive 
a direct connect via vs. a thermo relief via can be. 
>
>I have often wondered if the formula for thermo reliefs could be tweaked to 
provide the best of both worlds.
>
>Ted T.  

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