If you are using vias for heat transfer,
you don't use thermal relief "spokes".
(via pads are flooded into the copper pours)
Jack
.
On Tue, 5 Jan 2010 10:31:02 -0500, Tontis, Theodore
<[log in to unmask]> wrote:
>Bill,
>
>Do you know if that calculator can adjust the thermo relief used to attach
the via to a plane? I would be interested to see if changing the number and or
size of the spokes would have a greater impact then having it filled in with
solder? I would also be interested to see how much more thermally conductive
a direct connect via vs. a thermo relief via can be.
>
>I have often wondered if the formula for thermo reliefs could be tweaked to
provide the best of both worlds.
>
>Ted T.
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