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Date: | Wed, 6 Jan 2010 13:04:50 -0600 |
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James,
I carried out work on this area a 2-3 years back as part of PCB
supplier/material qualification program - Phenolic base v's dicy base
laminates was reviewed, didn't come across phenolic base with fillers to the
best of my knowledge.
(Aside: NP-170 (dicy) material had 15% inorganic filler material that
increased its Td value )
I was interested in the area of thermal performance (due tio lead free
reflow temp) & the material with higher Td (Decomposition temp) performed
better in my trials.
Phenolic base should be in the region of 350 - 370 Deg C - dicy base in the
region of 300 C.
So it would be worthwhile comparing the phenolic material with filler's Td
to known values, also whether it a dicy base with filler material that is
posing as phenolic?
Regards
Paul O' Connor
On Mon, 4 Jan 2010 10:51:23 +0000, James Liddle <[log in to unmask]>
wrote:
>Hello
>
>I'm looking for feedback with respect to writing a PWB Laminate
Specification that is tight enough to ensure consistent PWA performance and
reliability; but which is also flexible enough to ensure good
'Manufacturability'.
>
>Up until now our Fabricator has used Isola IS410, which is a Phenolic
Laminate without Fillers that conforms to IPC-4101B Specification Sheets 124
and 129. I'm quite happy to approve alternative manufacturer equivalents
which have the same composition and conform to the same Specification
Sheets; ITEQ's IT-180 for example. However, our Fabricator has a
preference for a Phenolic Laminate with Fillers, that conforms to IPC-4101B
Specification Sheets 99 and 126.
>
>Am I being overly cautious if I deny their request for change? Can anyone
report any adverse experiences they have had when making this change, that I
should be aware of? Are there any differences in the properties or
characteristics of the two types of Laminates that I should pay particular
attention to?
>
>Thanks
>
>James Liddle
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