Subject: | |
From: | |
Reply To: | |
Date: | Tue, 5 Jan 2010 17:12:19 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hi Steve
Your question brings up questions. Are the bonds, which are being tested
and failing, stitch or ball? Can you notice any physical differences in the
failures? Also what type of nickel plating are you using? It might be that
a higher stressed nickel is fracturing in bonding and setting up the site
to fail.
Cheers,
Joe
In a message dated 1/5/2010 1:18:08 P.M. Pacific Standard Time,
[log in to unmask] writes:
Hi All,
I have a wire bond question to the wire bond gurus who have helped me out
a lot in the past. Made 2 versions of a flex circuit - only varied the
nickel thickness. Application is thermosonic gold wire bonding.
Flex circuit lead is .0032 wide - version 1 - nickel is 150 microinches -
soft gold is 50 microinches- pull strength is X
Version 2 - nickel is 40 microinches - soft gold is 50 microinches - pull
strength is approx. ½X of version 1-
Is this what I should expect?
Regards Steve Kelly
Steve Kelly (PLEASE NOTE NEW E-MAIL ADDRESS)
(416) 750-8433 (work)
(416) 750-0016 (fax)
(416) 577-8433 (cell)
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|