So I guess you all find the issue as "interesting" as I do!
In a former life I have soldered quite a few on telecom product, using no-clean and I guess the long term reliability was met because probably the life of the product was within the 1K cycles mentioned by Richard.
But this time I have to CC and my means of investigation and testing are really not there.
Just like you, I have found the datasheet very evasive related to process and have shot an e-mail to Atmel, which seem to manage this product on north American land. Doesn't even say what the pad finish is and whether high-temp or not. I am waiting for an answer.
Thanks for all your inputs,
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
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