If your SOIC is heavy enough, surface tension of solder could not hold it when it was facing down. Please add some adhesives under this SOIC.





Best Regards,



James Liu 刘春光

Director, Technology & Standardization 技术与标准总监

IPC China

上海市长宁区延安西路1088号2303室

Suite 2303，#1088 West Yan'an Rd., Changning, Shanghai 200052 PRC

Tel:   +86 21 5497 3435

Fax:  +86 21 5497 3437

MP:   +86 136 0133 3491

[log in to unmask]<mailto:[log in to unmask]>

www.ipc.org.cn<http://www.ipc.org.cn>

________________________________

发件人: TGAsia [[log in to unmask]] 代表 Lu Zhengqiang (RBAC/MOE2.4-AE) [[log in to unmask]]

发送时间: 2009年12月18日 9:32

收件人: Listserv TGAsia

主题: [TGAsia] Component dropped after reflow side 2



 Hello, all,

            We meet a problem that:



1.       One SOIC on side 1 missing and was detect by high/room temperature test

2.       But after checked AOI, no failure record, means after reflow side 1, maybe that component still there, but after reflow side 2 it was dropped, or AOI didn't found the failure after reflow side 2

3.       After retest the failure board, AOI can found the failure, so we doubt the component was dropped after reflow side 2





            So:

1.       How do you look on this kind of failure, do you meet this problem before?

2.       At what kind of situation that the component will drop after reflow side 2?





BR

Lu