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December 2009

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Subject:
From:
"Grossmann, Guenter" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Grossmann, Guenter
Date:
Wed, 9 Dec 2009 09:40:07 +0100
Content-Type:
text/plain
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text/plain (1 lines)
Soldering SnPb solderballs with SnAgCu works. The problem of the maximum temperature can be overcome by vapour phase soldering at 240°C ( even 230°C) and prior drying of the components.

About reliability there are various reports. Woodrow from Boeing claimed that PB contamination in SnAgCu solder joints is even beneficial.



Best regards



Guenter



>-----Ursprüngliche Nachricht-----

>Von: TechNet [mailto:[log in to unmask]] Im Auftrag von Iven, Jowan

>Gesendet: Mittwoch, 9. Dezember 2009 09:24

>An: [log in to unmask]

>Betreff: Re: [TN] SnPb SOLDER BALLS WITH SAC SOLDER PASTE

>

>I agree with you Ioan,

>

>Most leaded bga's  have maximum temperature specifications below the

>lead-free process.

>So why worry about the balls when the bga is electrically damaged?

>

>

>Regards

>

>Jowan Iven

>Process Engineer

>Neways Advanced Applications

>

>

>

>-----Original Message-----

>From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea

>Sent: Tuesday, December 08, 2009 2:54 PM

>To: [log in to unmask]

>Subject: Re: SnPb SOLDER BALLS WITH SAC SOLDER PASTE

>

>Hi Lee,

>

>First, how would you reflow a leaded BGA at LF temperatures without

>popping it?

>

>Then, the closest paper I have, coming your way in a second, is

>something from AIM saying that Pb will deposit at the points that cool

>the slowest, making brittle Pb pockets at the interface with the pad.

>

>Regards,

>

>Ioan Tempea, ing.

>Ingénieur Principal de Fabrication / Senior Manufacturing Engineer

>T | 450.967.7100 ext.244

>E | [log in to unmask]

>W | www.digico.cc

>

>N'imprimer que si nécessaire - Print only if you must

>

>

>

>------Original Message------

>From: Lee Whiteman

>Sender: TechNet

>To: [log in to unmask]

>Subject: [TN] SnPb SOLDER BALLS WITH SAC SOLDER PASTE

>Sent: Dec 8, 2009 08:17

>

>I know about the problems with soldering BGAs with SAC solder balls and

>SnPb solder paste and read plenty of papers pro and con.

>

>I heard about a report where if you solder BGAs with SnPb solder balls

>using SAC solder paste, the resulting solder joint will be unreliable.

>Has

>anyone heard of anything like that? If there are any cross-sections or

>papers that you can share with me, that would be great.

>

>Thanks again.

>

>Lee Whiteman, PMP

>Senior Member Engineering Staff

>L-3 Communications East

>Telephone: (856) 338-3508

>FAX: (856) 338-2906

>E-Mail: [log in to unmask]

>

>

>

>

>

>SENTEC

>11 Canadian Road, Unit 7.

>Scarborough, ON M1R 5G1

>Tel: (416) 899-1882

>Fax: (905) 882-8812

>www.sentec.ca

>

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