I agree with you Ioan,
Most leaded bga's have maximum temperature specifications below the lead-free process.
So why worry about the balls when the bga is electrically damaged?
Regards
Jowan Iven
Process Engineer
Neways Advanced Applications
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Tuesday, December 08, 2009 2:54 PM
To: [log in to unmask]
Subject: Re: SnPb SOLDER BALLS WITH SAC SOLDER PASTE
Hi Lee,
First, how would you reflow a leaded BGA at LF temperatures without popping it?
Then, the closest paper I have, coming your way in a second, is something from AIM saying that Pb will deposit at the points that cool the slowest, making brittle Pb pockets at the interface with the pad.
Regards,
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask]
W | www.digico.cc
N'imprimer que si nécessaire - Print only if you must
------Original Message------
From: Lee Whiteman
Sender: TechNet
To: [log in to unmask]
Subject: [TN] SnPb SOLDER BALLS WITH SAC SOLDER PASTE
Sent: Dec 8, 2009 08:17
I know about the problems with soldering BGAs with SAC solder balls and
SnPb solder paste and read plenty of papers pro and con.
I heard about a report where if you solder BGAs with SnPb solder balls
using SAC solder paste, the resulting solder joint will be unreliable. Has
anyone heard of anything like that? If there are any cross-sections or
papers that you can share with me, that would be great.
Thanks again.
Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
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