TECHNET Archives

December 2009

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Thermally Conductive & Plated Via Fill
From:
Joe Lara <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joe Lara <[log in to unmask]>
Date:
Tue, 29 Dec 2009 13:55:05 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines) 
Hello TechNetter's,

Im currently using Du Ponts "CB-100" Conductive Paste to vill Vias at $400 per 100G. Is 
there a more affordable way of filling vias that call out to be filled (thermal conductive) and 
plated?


Best Regards,

Joe

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2