If the part only has 2-3 uinch of gold, it has no more gold than an ENIG pc 
board.  So why would you try to remove it?  Removal of gold adds process 
steps that have the potential to damage or age the component.  The result is 
likely leads with lumps of solder on them or shorts.  Allowable gold content in 
lead-free joints is not yet understood, although since I suspect it has more to 
do with the quantity of gold-tin intermetallics vs the amount of tin left in the 
joint, the rule of thumb is about the same as for tin-lead.  The rule of thumb 
has worked well for us.

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