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TechNet E-Mail Forum <[log in to unmask]>, Dave He <[log in to unmask]>
Date:
Tue, 22 Dec 2009 08:45:41 -0800
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Hello,

I have a question about tinning the gold-plated SMT component as specified
in J-STD-001, 3.9.3 bullet 2.

As more and more SMT components, such as crystal, oscillator, inductor and
connectors, are gold plated, the tinning becomes more and more difficult,
especially for fine pitch components. Some gold plating is only 2-3 u" thick
per the mfr. Some white paper also mentions if the gold is less than 3 wt%
of the solder joint, there is no chance of embrittlement. 

I am searching professional idea for the gold removal on SMT component, will
it be terminated if the thickness is less than a certain level? Thanks.



Best regards,
 
Dave He
 
Process & Manufacturing Engineer
Smart Electronics & Assembly, Inc.
2000 W Corporate Way
Anaheim  CA
92801
 
Phone: 714-991-6500 ext 333
Fax: 714-518-5411
 
www.smartelec.com

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