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December 2009

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Subject:
Re: Via fill on flex
From:
James Mahoney <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, James Mahoney <[log in to unmask]>
Date:
Tue, 22 Dec 2009 11:30:51 -0500
Content-Type:
text/plain
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text/plain (65 lines) 
It's very difficult to repair or prevent something beyond the rated materials performances you are only asking for trouble.

Happy Holidays!
www.quickturnflex.com
Thank you, 
Jim Mahoney 
Quick Turn Flex Circuits, LLC 
Applications Project Manager 
P# 603-821-7071
M# 603-305-6250 
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly
Sent: Tuesday, December 22, 2009 11:26 AM
To: [log in to unmask]
Subject: [TN] Via fill on flex

Hi All,

We have a 6 layer flex that my customer has to thermal cycle at temperatures beyond the rated Tg's of the material- the end use environment is about as bad as it gets. After repeated thermal cycles we start to see cracks develop in the glue layer used to bond the adhesiveless layers together. Will some kind of via fill help this issue?

Thanks in advance.

Regards Steve Kelly





Steve Kelly (PLEASE NOTE NEW E-MAIL ADDRESS)

(416) 750-8433 (work)

(416) 750-0016 (fax)

(416) 577-8433 (cell)




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