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December 2009

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Guy Ramsey <[log in to unmask]>
Date:
Mon, 14 Dec 2009 10:41:08 -0500
Content-Type:
text/plain
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text/plain (52 lines)
The section in the 610 that addresses this is edge delamination. Is it
inadequate? 
I would say you can use the 600 spec even after assembly. The assembly is a
populated defect. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Monday, December 14, 2009 10:22 AM
To: [log in to unmask]
Subject: [TN] Acceptability of Shredded Board Edge

Greetings!

We have an assembly where the board edge was ripped badly during
depanelization.

I searched through the Assembly Acceptability IPC-A-610 and didn't find
much, but
in the bare board IPC-A-600 section 2.1, I can see plainly that ours is
rejectable.

The question is, can I use the BARE BOARD spec to reject an ASSEMBLY?
Or is there anything in the assembly specs that covers depanelization
damage?

thanks,
Jack

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