Greetings!

We have an assembly where the board edge was ripped badly during
depanelization.

I searched through the Assembly Acceptability IPC-A-610 and didn't find
much, but
in the bare board IPC-A-600 section 2.1, I can see plainly that ours is
rejectable.

The question is, can I use the BARE BOARD spec to reject an ASSEMBLY?
Or is there anything in the assembly specs that covers depanelization
damage?

thanks,
Jack

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