Hi Jowan,
If the part can only take 220C, you will have difficulties making
consistently good solder joints even with SnPb, unless the BGA is very
small.
Werner
-----Original Message-----
From: Iven, Jowan <[log in to unmask]>
To: Werner Engelmaier <[log in to unmask]>; [log in to unmask]
Sent: Thu, Dec 10, 2009 2:46 am
Subject: RE: [TN] SnPb SOLDER BALLS WITH SAC SOLDER PASTE
Werner,
These components are only suitable for leaded processes is my opinion.
The discussion focussed on the ball alloy and the reliability issues
related to it.
I was only mentioning that not only the alloy of the balls is a subject
when looking at SnPb bga's in a lead free process.
Jowan
-----Original Message-----
From: Werner Engelmaier [mailto:[log in to unmask]]
Sent: Wednesday, December 09, 2009 8:51 PM
To: [log in to unmask]; Iven, Jowan
Subject: Re: [TN] SnPb SOLDER BALLS WITH SAC SOLDER PASTE
Hi Jowan,
If " the maximum temperature of the bga is 220°C" then any kind of
soldering, other than with In-based solders, is not an option-glueing?
Werner
-----Original Message-----
From: Iven, Jowan <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, Dec 9, 2009 3:46 am
Subject: Re: [TN] SnPb SOLDER BALLS WITH SAC SOLDER PASTE
Hello Guenter,
Your right but I've seen several specs where the maximum temperature of
the bga is 220°C. So Vapour Phase would not be an option for these
components.
Bottomline is: check the maximum temperature of the leaded components
in a specific lead free process. (for those who would like to do so).
Regards
Jowan Iven
Process Engineer
Neways Advanced Applications
-----Original Message-----
From: Grossmann, Guenter [mailto:[log in to unmask]]
Sent: Wednesday, December 09, 2009 9:40 AM
To: TechNet E-Mail Forum; Iven, Jowan
Subject: AW: SnPb SOLDER BALLS WITH SAC SOLDER PASTE
Soldering SnPb solderballs with SnAgCu works. The problem of the
maximum temperature can be overcome by vapour phase soldering at 240°C
( even 230°C) and prior drying of the components.
About reliability there are various reports. Woodrow from Boeing
claimed that PB contamination in SnAgCu solder joints is even
beneficial.
Best regards
Guenter
>-----Ursprüngliche Nachricht-----
>Von: TechNet [mailto:[log in to unmask]] Im Auftrag von Iven, Jowan
>Gesendet: Mittwoch, 9. Dezember 2009 09:24
>An: [log in to unmask]
>Betreff: Re: [TN] SnPb SOLDER BALLS WITH SAC SOLDER PASTE
>
>I agree with you Ioan,
>
>Most leaded bga's have maximum temperature specifications below the
>lead-free process.
>So why worry about the balls when the bga is electrically damaged?
>
>
>Regards
>
>Jowan Iven
>Process Engineer
>Neways Advanced Applications
>
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
>Sent: Tuesday, December 08, 2009 2:54 PM
>To: [log in to unmask]
>Subject: Re: SnPb SOLDER BALLS WITH SAC SOLDER PASTE
>
>Hi Lee,
>
>First, how would you reflow a leaded BGA at LF temperatures without
>popping it?
>
>Then, the closest paper I have, coming your way in a second, is
>something from AIM saying that Pb will deposit at the points that cool
>the slowest, making brittle Pb pockets at the interface with the pad.
>
>Regards,
>
>Ioan Tempea, ing.
>Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
>T | 450.967.7100 ext.244
>E | [log in to unmask]
>W | www.digico.cc
>
>N'imprimer que si nécessaire - Print only if you must
>
>
>
>------Original Message------
>From: Lee Whiteman
>Sender: TechNet
>To: [log in to unmask]
>Subject: [TN] SnPb SOLDER BALLS WITH SAC SOLDER PASTE
>Sent: Dec 8, 2009 08:17
>
>I know about the problems with soldering BGAs with SAC solder balls and
>SnPb solder paste and read plenty of papers pro and con.
>
>I heard about a report where if you solder BGAs with SnPb solder balls
>using SAC solder paste, the resulting solder joint will be unreliable.
>Has
>anyone heard of anything like that? If there are any cross-sections or
>papers that you can share with me, that would be great.
>
>Thanks again.
>
>Lee Whiteman, PMP
>Senior Member Engineering Staff
>L-3 Communications East
>Telephone: (856) 338-3508
>FAX: (856) 338-2906
>E-Mail: [log in to unmask]
>
>
>
>
>
>SENTEC
>11 Canadian Road, Unit 7.
>Scarborough, ON M1R 5G1
>Tel: (416) 899-1882
>Fax: (905) 882-8812
>www.sentec.ca
>
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This e-mail and any attachment is confidential and may be legally
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