Jack,

        In my opinion, you are doing what is typically a board level 
operation (removing the board from the panel) at the assembly level for 
your convenience.  The board level requirements are applicable.

Thanks,
Lance




Jack Olson <[log in to unmask]> 
Sent by: IPC-600-6012 <[log in to unmask]>
12/14/2009 09:56 AM
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"(Combined Forum of D-33a and 7-31a Subcommittees)" <[log in to unmask]>


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Subject
[IPC-600-6012] Acceptability of Shredded Board Edge






Greetings!

We have an assembly where the board edge was ripped badly during
depanelization.

I searched through the Assembly Acceptability IPC-A-610 and didn't find
much, but in the bare board IPC-A-600 section 2.1, I can see plainly
that ours is rejectable.

The question is, can I use the BARE BOARD spec to reject an ASSEMBLY?
Or is there anything in the assembly specs that covers depanelization
damage?

thanks,
Jack