IPC-600-6012 Archives

December 2009

IPC-600-6012@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Acceptability of Shredded Board Edge
From:
Jack Olson <[log in to unmask]>
Reply To:
(Combined Forum of D-33a and 7-31a Subcommittees)
Date:
Mon, 14 Dec 2009 10:51:10 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (16 lines) 
Greetings!

We have an assembly where the board edge was ripped badly during
depanelization.

I searched through the Assembly Acceptability IPC-A-610 and didn't find
much, but in the bare board IPC-A-600 section 2.1, I can see plainly
that ours is rejectable.

The question is, can I use the BARE BOARD spec to reject an ASSEMBLY?
Or is there anything in the assembly specs that covers depanelization
damage?

thanks,
Jack

ATOM RSS1 RSS2