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Date: | Tue, 29 Dec 2009 12:28:35 -0800 |
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Practically speaking, using "thermal conductive" and "CB100" in the
same sentence is an oxymoron.
Cu ~= 300 w/mK
Solder, Ormet, et al ~= 25 w/mk
CB100 ~=3 w/mK
Small amount more annular copper, filling with Ormet paste (not a
cheaper option though) or filling via in process with solder yields
much greater increase in thermal conductivity than CB100.
At 11:55 AM 12/29/2009, Joe Lara wrote:
>Hello TechNetter's,
>
>Im currently using Du Ponts "CB-100" Conductive Paste to vill Vias
>at $400 per 100G. Is
>there a more affordable way of filling vias that call out to be
>filled (thermal conductive) and
>plated?
>
>
>Best Regards,
>
>Joe
>
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