IPC-600-6012 Archives

December 2009

IPC-600-6012@IPC.ORG
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IPC-600-6012<[log in to unmask]>
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Date:
Tue, 8 Dec 2009 07:47:00 -0500
Reply-To:
"(Combined Forum of D-33a and 7-31a Subcommittees)" <[log in to unmask]>
Subject:
Re: coupon design question
From:
Jose A Rios <[log in to unmask]>
In-Reply-To:
<OF7CCD9DA5.D9DBC811-ON85257681.0077C99A-85257681.0078AD66@LocalDomain>
Content-Type:
multipart/mixed; boundary="=_mixed 0046392B85257686_="
MIME-Version:
1.0
Parts/Attachments:
text/plain (986 bytes) , E H as generated top layer.ppt (92 kB) , E H as generated voltage layer.ppt (91 kB) , E H proposed voltage layer.ppt (91 kB) 
resending my question.....

Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896



Jose A Rios/Endicott/EIT
12/03/2009 04:58 PM

To
"(Combined Forum of D-33a and 7-31a Subcommittees)" <[log in to unmask]>
cc

Subject
coupon design question





Question to the group, has to do with coupon design: In order to better 
distribute resin fill on a tightly fitted board/coupon array within a 
panel, do the following modifications to voltage layers on E & H coupons 
violate any of the 2221 design rules?? I dont beleive so, but I'd like 
some validation. 
Refer to screenshots below (as generated, voltage plane as generated, 
proposed voltage plane). Ignore the S & T coupons for purposes of this 
discussion.
Thanks.

1: As Generated:

2:Voltage plane, as generated, black is copper
 
3: Proposed voltage plane, black is copper:


Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896

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