Jack,
In my opinion, you are doing what is typically a board level
operation (removing the board from the panel) at the assembly level for
your convenience. The board level requirements are applicable.
Thanks,
Lance
Jack Olson <[log in to unmask]>
Sent by: IPC-600-6012 <[log in to unmask]>
12/14/2009 09:56 AM
Please respond to
"(Combined Forum of D-33a and 7-31a Subcommittees)" <[log in to unmask]>
To
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Subject
[IPC-600-6012] Acceptability of Shredded Board Edge
Greetings!
We have an assembly where the board edge was ripped badly during
depanelization.
I searched through the Assembly Acceptability IPC-A-610 and didn't find
much, but in the bare board IPC-A-600 section 2.1, I can see plainly
that ours is rejectable.
The question is, can I use the BARE BOARD spec to reject an ASSEMBLY?
Or is there anything in the assembly specs that covers depanelization
damage?
thanks,
Jack