IPC-600-6012 Archives

December 2009

IPC-600-6012@IPC.ORG
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IPC-600-6012<[log in to unmask]>
Subject:
Acceptability of Shredded Board Edge
From:
Jack Olson <[log in to unmask]>
Date:
Mon, 14 Dec 2009 10:51:10 -0600
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"(Combined Forum of D-33a and 7-31a Subcommittees)" <[log in to unmask]>
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Greetings!

We have an assembly where the board edge was ripped badly during
depanelization.

I searched through the Assembly Acceptability IPC-A-610 and didn't find
much, but in the bare board IPC-A-600 section 2.1, I can see plainly
that ours is rejectable.

The question is, can I use the BARE BOARD spec to reject an ASSEMBLY?
Or is there anything in the assembly specs that covers depanelization
damage?

thanks,
Jack

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