Per IPC 610D and J-STD-001D, small voids, pinholes, and blowholes are acceptable provided you can visually see the sides and bottom under 4X magnification.
You also need to be aware of the accumulation of characteristics, however. Lots of voids and a component 25% off the pad, and marginal solder appearance, for example, all on one part would be cause for rejection/rework.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev
Sent: Saturday, November 07, 2009 10:36 AM
To: [log in to unmask]
Subject: Re: [TN] Solder Voids in Chip Components
Bev,
I'm not that much sure about the definition of the "voids... open to the surface" and how they may affect the reliability. Remember, that voids do next to nothing in terms of stress concentration.
Regards,
Vladimir
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
-----Original Message-----
From: Bev Christian <[log in to unmask]>
Date: Sat, 7 Nov 2009 11:10:50
To: <[log in to unmask]>
Subject: Re: [TN] Solder Voids in Chip Components
Correct. Or the voids are open to the surface, as Joyce K pointed out to me.
Bev
----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Sat Nov 07 11:02:58 2009
Subject: Re: [TN] Solder Voids in Chip Components
Unless there is a significant "segregation" of rather small voids at one of the interfaces :-)
Vladimir
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
-----Original Message-----
From: Bev Christian <[log in to unmask]>
Date: Sat, 7 Nov 2009 10:59:31
To: <[log in to unmask]>
Subject: Re: [TN] Solder Voids in Chip Components
Alejandro,
No there is not.
In the 10 years I was at Nortel we could never see any significant difference between shear strength of solder joints with low voiding and those that looked like Swiss cheese (up to 50% voiding). I am sure that Werner will come back and rightly say that shear strength does not necessarily equate to solder joint reliability. But I can say we never saw chip cap problems that were traceable to the joint voids.
Bev
----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Sat Nov 07 10:40:25 2009
Subject: [TN] Solder Voids in Chip Components
Hello,
Does anybody know if there is an IPC specification that describes the amount of solder voids allowed in a chip component solder joint? The IPC-A-610 Rev D is specific describing the % of voids allowed for BGA's solder joints (<25%) only but not for any other type of components.
Saludos Cordiales / Best Regards
Alejandro A. Domínguez
Robert Bosch Corporation
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