Inge,
You get to play with the weirdest stuff! I was referring to "normal" cases.
Something more down to earth though is voiding in LGA/QFN central thermal pads. What do people allow for that?
Bev
RIM
----- Original Message -----
From: Inge <[log in to unmask]>
To: TechNet E-Mail Forum <[log in to unmask]>; Bev Christian
Sent: Sat Nov 07 11:41:15 2009
Subject: Re: [TN] Solder Voids in Chip Components
There is an exception, namely when you have to do with high power chips. We
mounted HexFets that disspated 200 Watts, and those with too much voids
simply burnt.
By the way, I got no answer from Kevin about how to planarize heat via
solder fills. Anyone?
/Inge
----- Original Message -----
From: "Bev Christian" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Saturday, November 07, 2009 5:10 PM
Subject: Re: [TN] Solder Voids in Chip Components
Correct. Or the voids are open to the surface, as Joyce K pointed out to me.
Bev
----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Sat Nov 07 11:02:58 2009
Subject: Re: [TN] Solder Voids in Chip Components
Unless there is a significant "segregation" of rather small voids at one of
the interfaces :-)
Vladimir
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
-----Original Message-----
From: Bev Christian <[log in to unmask]>
Date: Sat, 7 Nov 2009 10:59:31
To: <[log in to unmask]>
Subject: Re: [TN] Solder Voids in Chip Components
Alejandro,
No there is not.
In the 10 years I was at Nortel we could never see any significant
difference between shear strength of solder joints with low voiding and
those that looked like Swiss cheese (up to 50% voiding). I am sure that
Werner will come back and rightly say that shear strength does not
necessarily equate to solder joint reliability. But I can say we never saw
chip cap problems that were traceable to the joint voids.
Bev
----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Sat Nov 07 10:40:25 2009
Subject: [TN] Solder Voids in Chip Components
Hello,
Does anybody know if there is an IPC specification that describes the amount
of solder voids allowed in a chip component solder joint? The IPC-A-610 Rev
D is specific describing the % of voids allowed for BGA's solder joints
(<25%) only but not for any other type of components.
Saludos Cordiales / Best Regards
Alejandro A. Domínguez
Robert Bosch Corporation
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