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November 2009

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Subject:
Solder Voids in Chip Components
From:
"Dominguez Alejandro (JuP1/TEF8)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dominguez Alejandro (JuP1/TEF8) <[log in to unmask]>
Date:
Sat, 7 Nov 2009 10:40:25 -0500
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text/plain
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Hello,

Does anybody know if there is an IPC specification that describes the amount of solder voids allowed in a chip component solder joint?  The IPC-A-610 Rev D is specific describing the % of voids allowed for BGA's solder joints (<25%) only but not for any other type of components.     

Saludos Cordiales / Best Regards 
Alejandro A. Domínguez 
Robert Bosch Corporation



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