Vladimir,
Indeed nano.  Both platings were tested with the exact same protocol: Berkovich geometry, 1mN max load.  They are reporting penetration depth in nM.  The lab complained about the surface being too rough.  Might the IAu be un-uniform and the indenter is getting ahold of some Ni?  XRF with 4mil collimator doesn't show anything odd.  Saw some mudcracks via SEM on a "related" sample.

Or, should we just punt and say that comparisons can't be made?   If so, does anyone know what numbers you typically get from ENIG? 

Chris

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: Monday, November 02, 2009 9:34 PM
To: TechNet E-Mail Forum; Chris Mahanna
Subject: Re: [TN] IAu hardness

Hi Chris,

Are you sure you are talking about nanohardness and not microhardness?

If it's nanohardness, then the measured values are completely different from a common (microhardness) method due to the nature of nanohardness measurements.

Secondly (and even more important) on a plated sample (and particularly like ENIG with extremely thin layer of Au) the nanohardness readings will depend on the indentation load (read depth of penetration).

In general, you can not draw a direct comparison between nanohardness measurements done on a thick (your hard gold case) and extremely thin (ENIG case) plating.

Regards,

Vladimir
------Original Message------
From: Chris Mahanna
Sender: TechNet
To: [log in to unmask]
ReplyTo: TechNet E-Mail Forum
ReplyTo: Chris Mahanna
Sent: Nov 2, 2009 21:17
Subject: [TN] IAu hardness

Please help a simple EE.

From bare printed boards we are receiving nano-identation (hardness) values for hard (I assume Cobalt) gold in the 3000 MPa range.  Quick and dirty conversion yields ~300 Knoop/Vickers; right?
That sounds reasonable.

BUT, we're getting 6500 MPA for the ENIG.  Is this even possible?  Does anyone know if it is an indication of poor IAu?  Or maybe a poor nano-indentation tester?

Thanks,
Chris


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