Hello Bev,
This is an excellent idea, I will follow up with you for a suitable time to meet at RIM.
Cheers,
Paymon
-----Original Message-----
From: Bev Christian [mailto:[log in to unmask]]
Sent: Thursday, November 05, 2009 8:47 AM
To: TechNet E-Mail Forum; Paymon Sani
Subject: RE: [TN] Component Shelf Life
Paymon,
Those sound like excellent suggestions. #1 and #4 aren't going to be
cheap.
However, the failure of the solder joints later in the field does not
sound like a solderability problem as much as a reliability problem.
Thermal cycling? Thermal shock? Drop? Vibration? Extreme contamination?
A nickel layer not firmly attached to an Alloy42 lead frame? Not sure
what kind of parts you are talking about.
Hey, since you are only an hour or so down the road, why don't you come
and see us sometime?
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paymon Sani
Sent: Thursday, November 05, 2009 8:42 AM
To: [log in to unmask]
Subject: Re: [TN] Component Shelf Life
Hello Bev, All,
From my observations, I plan to make the following recommendations to my
team:
1- Store the components in an environment with controlled temperature
and humidity
2- Create a FIFO system to manage the age of components
3- Keep the slow moving parts sealed to prevent oxidization
4- Test the parts with old date codes (6 months to 1 year old) for
solder wetting as per JSTD
In this case, the component solder joints passed initial optical
inspection during the SMT build and failed at a later time in the field.
Thank you All for getting back to me,
Paymon Sani, P.Eng., M.A.Sc.
Quality Engineer
Creation Technologies
Office: 905.754.5000 x 5363
[log in to unmask] | www.creationtech.com
-----Original Message-----
From: Bev Christian [mailto:[log in to unmask]]
Sent: Wednesday, November 04, 2009 7:09 PM
To: 'TechNet E-Mail Forum'; Paymon Sani
Subject: RE: [TN] Component Shelf Life
Paymon,
Got too busy at work to reply. I am now signed on here at home, after a
nice meal and after watching the news with my wife. Yes, I am a guy.
Shelf life will affect solderability, which may affect things like % off
pad, etc. and the pass/fail criteria for this sort of thing varies
depending
on whether you are building class 1, 2 or 3 product.
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paymon Sani
Sent: Wednesday, November 04, 2009 3:35 PM
To: [log in to unmask]
Subject: Re: [TN] Component Shelf Life
Hello Bev, Gregg,
Thank you for getting back to me. I am curious now, how is it related to
the
IPC class?
Regards,
Paymon Sani
Quality Engineer
Creation Technologies
Office: 905.754.5000 x 5363
[log in to unmask] | www.creationtech.com
-----Original Message-----
From: Bev Christian [mailto:[log in to unmask]]
Sent: Wednesday, November 04, 2009 10:20 AM
To: TechNet E-Mail Forum; Paymon Sani
Subject: RE: [TN] Component Shelf Life
Paymon,
Gregg hit it on the nail head.
In addition, it is going to depend on finish, finish thickness (varies)
and what your level of acceptability is (which IPC class product do you
build?).
I also do not know of a published, recent standard on this topic.
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paymon Sani
Sent: Wednesday, November 04, 2009 9:54 AM
To: [log in to unmask]
Subject: [TN] Component Shelf Life
Dear Colleagues,
I am looking for a standard for component shelf life. Is anyone aware of
such document?
Best Regards,
Paymon Sani
Quality Engineer
Creation Technologies
Office: 905.754.5000 x 5363
110 Clegg Road | Markham, ON, Canada | L6G 1E1
[log in to unmask]<mailto:[log in to unmask]> |
www.creationtech.com<http://www.creationtech.com/>
[cid:[log in to unmask]]Working together to build the future
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