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November 2009

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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Mon, 30 Nov 2009 08:33:24 -0500
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Hi Doug!

Send them here: [log in to unmask]

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas Pauls
Sent: Monday, November 30, 2009 8:29 AM
To: [log in to unmask]
Subject: Re: [TN] BGAs & Conformal Coating

Good morning Juan,
I suspect that Xilinx wants you do do a thermal cycle study on solder 
joint reliability when conformal coating gets under the BGA.  The stresses 
brought about by a mismatches in the coefficient of thermal expansion 
(CTE) can rip a BGA off the board and can severely deform the balls. 
Hillman and I did such a study here a few years ago.  I can share a few 
pictures of what happens, if Steve Gregory would be kind enough to forward 
his present e-mail address for the photos.  Not sure I have the right one.

Doug Pauls



"Juan T. Marugán" <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
11/26/2009 11:53 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
"Juan T. Marugán" <[log in to unmask]>


To
[log in to unmask]
cc

Subject
[TN] BGAs & Conformal Coating






Hi,

I've read in a Xilinx guide that: "Xilinx has no experience or reliability 
data on 
flip-chip BGA packages on board after exposure to conformal coating. It is 

recommended that the end-user should characterize the board level 
reliability 
performance of Xilinx packages before production use."

Does anybody know any infomation or study related with this topic?

Thank you.

Juan T. Marugán
Indra Sistemas SA
Espańa

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