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Subject:	Re: BGAs & Conformal Coating
From:	Hernefjord Ingemar <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Hernefjord Ingemar <[log in to unmask]>
Date:	Fri, 27 Nov 2009 09:14:17 +0100
Content-Type:	text/plain
Parts/Attachments:	text/plain (44 lines)

Juan,
I recommend you to contact, what I call Mme Flipchip, at Ericsson Telecom. She knows 'everything' about Flipchips.
If you don't know her, I can send her adress offline.

We have been using Xilinx BGAs for years, from largest superBGAs to smallest ones. We have never had any issues with the combination BGA-CC. What could be a problem?


/Inge


 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Juan T. Marugán
Sent: torsdag 26 november 2009 18:53
To: [log in to unmask]
Subject: [TN] BGAs & Conformal Coating

Hi,

I've read in a Xilinx guide that: "Xilinx has no experience or reliability data on flip-chip BGA packages on board after exposure to conformal coating. It is recommended that the end-user should characterize the board level reliability performance of Xilinx packages before production use."

Does anybody know any infomation or study related with this topic?

Thank you.

Juan T. Marugán
Indra Sistemas SA
España

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