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November 2009

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Subject:
BGAs & Conformal Coating
From:
"Juan T. Marugán" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Juan T. Marugán
Date:
Thu, 26 Nov 2009 11:53:29 -0600
Content-Type:
text/plain
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text/plain (25 lines) 
Hi,

I've read in a Xilinx guide that: "Xilinx has no experience or reliability data on 
flip-chip BGA packages on board after exposure to conformal coating. It is 
recommended that the end-user should characterize the board level reliability 
performance of Xilinx packages before production use."

Does anybody know any infomation or study related with this topic?

Thank you.

Juan T. Marugán
Indra Sistemas SA
España

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