'your thumb in the supplier's eye' , that is our motto, and it works....

Inge


----- Original Message ----- 
From: "Stadem, Richard D." <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, November 24, 2009 5:01 PM
Subject: Re: [TN] solder fracture solderable?


You need to perform continual auditing of the supplier, and in addition
you should have some type of solderability check using representative
coupons.
Unfortunately, not even those two steps ensure you will not get boards
with ENIG issues.
Not only that, but the boards can fail after they have left your plant
from either BN or BP.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Blair Hogg
Sent: Tuesday, November 24, 2009 9:00 AM
To: [log in to unmask]
Subject: Re: [TN] solder fracture solderable?

How do those of us who purchase and use ENIG boards know that we are
getting good product? Continual auditing of the supplier? SPC data for
each
shipment?

If you find a reliable source, how do you know they stay reliable? Or do
you
find a shipment comes in one day and you build a hundred boards with
high
failure rate?

Blair

On Mon, 23 Nov 2009 23:50:07 +0100, Inge <[log in to unmask]>
wrote:

>...and responsible operators....
>Inge
>
>
>----- Original Message -----
>From: "Joyce Koo" <[log in to unmask]>
>To: <[log in to unmask]>
>Sent: Monday, November 23, 2009 9:22 PM
>Subject: Re: [TN] solder fracture solderable?
>
>
>Bath chemistry and pH and temp.
>--------------------------
>Sent using BlackBerry
>
>
>----- Original Message -----
>From: TechNet <[log in to unmask]>
>To: [log in to unmask] <[log in to unmask]>
>Sent: Mon Nov 23 15:15:04 2009
>Subject: Re: [TN] solder fracture solderable?
>
>
> Hi Bob,
>No, you read it correctly, and put your finger squarely in the problem.
>Werner
>
>
>-----Original Message-----
>From: Robert Kondner <[log in to unmask]>
>To: [log in to unmask]
>Sent: Mon, Nov 23, 2009 3:10 pm
>Subject: Re: [TN] solder fracture solderable?
>
>
>Hi,
>
> The other week there was talk about ENIG vs HASL so I have been
searching
>around the web for ENIG info. I read a number of items.
>
> I recall reading that a phosphorus (in nickel) content of > 10% (I
think it
>was %) was required to control the Immersion Gold thickness and better
>control corrosion resistance. Wow, 10% sounds high but I guess that is
>right.
>
>  The photos show a P+ layer at the failed interface. Does that imply
>increasing P is a problem at making "Strong" soldered connections?
>
>  How does a lowly PCB user monitor this kind of parameter of
phosphorus so
>it is not too much or not too little?
>
>  Or did I misread the entire scenario?
>
>Thanks,
>Bob Kondner
>

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to 
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to 
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 
for additional information, or contact Keach Sasamori at [log in to unmask] or 
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------