Hi Bob - we typically require 900 +/- 300 uinches for HASL thickness. Good
solderability life and reasonable flatness at those values.
Dave Hillman
Rockwell Collins
[log in to unmask]
Robert Kondner <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
11/24/2009 09:52 AM
Please respond to
[log in to unmask]
To
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cc
Subject
Re: [TN] solder fracture solderable?
Hi,
Can anyone tell me what is involved to do a quick verification of HASL
solder coating thickness?
Any number on minimal coating required to prevent under metal oxidation?
Thanks,
Bob Kondner
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee Whiteman
Sent: Tuesday, November 24, 2009 10:26 AM
To: [log in to unmask]
Subject: Re: [TN] solder fracture solderable?
Blair,
Q1: How do those of us who purchase and use ENIG boards know that we are
getting good product? First, we clearly provide our requirements to our
board suppliers. Second, we inspect panels and coupons per IPC-6012. At
time, we would perform XRF analysis to confirm the thickness of the gold
and nickel layers.
Q2: Continual auditing of the supplier? We have performed off-site
(Incoming Inspection) and on-site audits of our suppliers.
Q3; SPC data for each shipment? While we don't require it, we have
access to their SPC data if there is a problem with the shipment.
Hope this helps. Good Luck.
Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Blair Hogg
Sent: Tuesday, November 24, 2009 10:00 AM
To: [log in to unmask]
Subject: Re: [TN] solder fracture solderable?
How do those of us who purchase and use ENIG boards know that we are
getting good product? Continual auditing of the supplier? SPC data for
each
shipment?
If you find a reliable source, how do you know they stay reliable? Or do
you
find a shipment comes in one day and you build a hundred boards with
high
failure rate?
Blair
On Mon, 23 Nov 2009 23:50:07 +0100, Inge <[log in to unmask]>
wrote:
>...and responsible operators....
>Inge
>
>
>----- Original Message -----
>From: "Joyce Koo" <[log in to unmask]>
>To: <[log in to unmask]>
>Sent: Monday, November 23, 2009 9:22 PM
>Subject: Re: [TN] solder fracture solderable?
>
>
>Bath chemistry and pH and temp.
>--------------------------
>Sent using BlackBerry
>
>
>----- Original Message -----
>From: TechNet <[log in to unmask]>
>To: [log in to unmask] <[log in to unmask]>
>Sent: Mon Nov 23 15:15:04 2009
>Subject: Re: [TN] solder fracture solderable?
>
>
> Hi Bob,
>No, you read it correctly, and put your finger squarely in the problem.
>Werner
>
>
>-----Original Message-----
>From: Robert Kondner <[log in to unmask]>
>To: [log in to unmask]
>Sent: Mon, Nov 23, 2009 3:10 pm
>Subject: Re: [TN] solder fracture solderable?
>
>
>Hi,
>
> The other week there was talk about ENIG vs HASL so I have been
searching
>around the web for ENIG info. I read a number of items.
>
> I recall reading that a phosphorus (in nickel) content of > 10% (I
think it
>was %) was required to control the Immersion Gold thickness and better
>control corrosion resistance. Wow, 10% sounds high but I guess that is
>right.
>
> The photos show a P+ layer at the failed interface. Does that imply
>increasing P is a problem at making "Strong" soldered connections?
>
> How does a lowly PCB user monitor this kind of parameter of
phosphorus so
>it is not too much or not too little?
>
> Or did I misread the entire scenario?
>
>Thanks,
>Bob Kondner
>
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