Before you select your vendor, you give them hell. If you don't do it at qual stage, they will give you hell. Live to tell a story after you go through the hell one way or the other.
--------------------------
Sent using BlackBerry
----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Tue Nov 24 10:00:25 2009
Subject: Re: [TN] solder fracture solderable?
How do those of us who purchase and use ENIG boards know that we are
getting good product? Continual auditing of the supplier? SPC data for each
shipment?
If you find a reliable source, how do you know they stay reliable? Or do you
find a shipment comes in one day and you build a hundred boards with high
failure rate?
Blair
On Mon, 23 Nov 2009 23:50:07 +0100, Inge <[log in to unmask]>
wrote:
>...and responsible operators....
>Inge
>
>
>----- Original Message -----
>From: "Joyce Koo" <[log in to unmask]>
>To: <[log in to unmask]>
>Sent: Monday, November 23, 2009 9:22 PM
>Subject: Re: [TN] solder fracture solderable?
>
>
>Bath chemistry and pH and temp.
>--------------------------
>Sent using BlackBerry
>
>
>----- Original Message -----
>From: TechNet <[log in to unmask]>
>To: [log in to unmask] <[log in to unmask]>
>Sent: Mon Nov 23 15:15:04 2009
>Subject: Re: [TN] solder fracture solderable?
>
>
> Hi Bob,
>No, you read it correctly, and put your finger squarely in the problem.
>Werner
>
>
>-----Original Message-----
>From: Robert Kondner <[log in to unmask]>
>To: [log in to unmask]
>Sent: Mon, Nov 23, 2009 3:10 pm
>Subject: Re: [TN] solder fracture solderable?
>
>
>Hi,
>
> The other week there was talk about ENIG vs HASL so I have been searching
>around the web for ENIG info. I read a number of items.
>
> I recall reading that a phosphorus (in nickel) content of > 10% (I think it
>was %) was required to control the Immersion Gold thickness and better
>control corrosion resistance. Wow, 10% sounds high but I guess that is
>right.
>
> The photos show a P+ layer at the failed interface. Does that imply
>increasing P is a problem at making "Strong" soldered connections?
>
> How does a lowly PCB user monitor this kind of parameter of phosphorus so
>it is not too much or not too little?
>
> Or did I misread the entire scenario?
>
>Thanks,
>Bob Kondner
>
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