Hello Eric,
For moisture sensitive package handling, storage ,packaging and floor
life after opening bags, please refer to J-STD-033B.1 .
Please go to www.jedec.org to view the standard.
Mumtaz Bora
Senior Quality Engineer
Peregrine Semiconductor
9380 Carroll Park Drive
San Diego, CA 92121
858-795-0112-direct
858-731-9499 -fax
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SMTAI, October 6-7, 2009 in San Diego, CA - a world-class conference
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eric CHRISTISON
Sent: Wednesday, November 04, 2009 7:34 AM
To: [log in to unmask]
Subject: Re: [TN] Component Shelf Life
What about moisure sensitivity? I'm thinking about MSL classifications
which are outlines in a Jedec spec which I can't lay my hands on right
now? A bit of a vague question.
Regards,
Bev Christian wrote:
> Paymon,
> Gregg hit it on the nail head.
>
> In addition, it is going to depend on finish, finish thickness
> (varies) and what your level of acceptability is (which IPC class
> product do you build?).
>
> I also do not know of a published, recent standard on this topic.
> Bev
> RIM
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Paymon Sani
> Sent: Wednesday, November 04, 2009 9:54 AM
> To: [log in to unmask]
> Subject: [TN] Component Shelf Life
>
> Dear Colleagues,
>
> I am looking for a standard for component shelf life. Is anyone aware
> of such document?
>
> Best Regards,
>
> Paymon Sani
> Quality Engineer
> Creation Technologies
>
> Office: 905.754.5000 x 5363
> 110 Clegg Road | Markham, ON, Canada | L6G 1E1
> [log in to unmask]<mailto:[log in to unmask]> |
> www.creationtech.com<http://www.creationtech.com/>
>
> [cid:[log in to unmask]]Working together to build the
> future
>
>
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--
Eric Christison Msc
Mechanical Engineer
Consumer & Micro group
Imaging Division
STMicroelectronics (R&D) Ltd
33 Pinkhill
Edinburgh EH12 7BF
United Kingdom
Tel: +44 (0)131 336 6165
Fax: + 44 (0)131 336 6001
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