Fortunately for us, Ioan was kind enough to forward a copy of the ERSA DFM
guidelines to us, which I never could find on the ERSA website (or I would
provide a link to it) but the name of it is VF_Layout_eng_V203.ppt

Anyway it was VERY helpful, they did a good job on it.

If anyone is interested, they put a restriction on the height of components
near the board edge, a bottom-side height restriction, and a clearance
around every soldering point depending on the nozzle diameter. We have
decided to design for a 6mm nozzle by default, and for that one there should
be no components in a 3mm radius of the CENTER of the nozzle (that's for
single-point soldering, for rows they want 3mm from the edge of the nozzle,
not the center ) and an EXTRA 3mm clearance to the conveyor rail if the
soldering point is close to the board edge.

thanks for the help, everyone (and a SPECIAL thank you to Ioan!)(smile)
Jack
On Tue, Nov 17, 2009 at 9:42 AM, Dave Schaefer <[log in to unmask]>wrote:

> Jack,
>
> Clearance is dictated by the Nozzle Size of the select solder machine. We
> use Nozzle Size +3mm diameter as a clearance rule. For most products we end
> up with a 11mm (0.433") keepout diameter ... we did at times violate but
> only with smt components that could be glued and not damaged by being
> subjected to secondary select solder.
>
> hth,
> Dave
>
>

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