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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Werner Engelmaier <[log in to unmask]>
Date:
Tue, 17 Nov 2009 14:59:05 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (232 lines)
 Inge, my friend,
Did not take it as 'Beleidigung'–Skol to you, and may nobody drink from our skulls for a long time.

Werner

 

 

-----Original Message-----
From: Inge <[log in to unmask]>
To: [log in to unmask]; Werner Engelmaier <[log in to unmask]>
Sent: Tue, Nov 17, 2009 2:49 pm
Subject: Re: [TN] Microvia reliability vs Lead free
















Hi W,


 




Es 
war nicht zu beleidigen, just played with white paper ...


Inge



 


 


 



  
----- Original Message ----- 

  
From: 
  Werner 
  Engelmaier 

  
To: [log in to unmask] ; [log in to unmask] 

  
Sent: Tuesday, November 17, 2009 4:58 
  PM

  
Subject: Re: [TN] Microvia reliability vs 
  Lead free

  



  
Hi Inge,
Bucks 
  are green.
But you should know, nothing good is for nothing. 
I take it, 
  you work pro bono for Saab ;-)
Werner


  



  


-----Original Message-----
From: Inge <[log in to unmask]>
To: 
  TechNet E-Mail Forum <[log in to unmask]>; Werner 
  Engelmaier <[log in to unmask]>
Sent: Mon, Nov 
  16, 2009 11:14 pm
Subject: Re: [TN] Microvia reliability vs Lead 
  free


  
Sure,Werner, with black 
  payment? 
/Inge 
 
----- Original Message ----- From: 
  "Werner Engelmaier" <[log in to unmask]> 
To: 
  <[log in to unmask]> 
Sent: 
  Monday, November 16, 2009 5:04 PM 
Subject: Re: [TN] Microvia 
  reliability vs Lead free 
 
Hi Inge, 
Certainly have. 
  This is not new, and it is not very surprising. 
You may be interested 
  in my White Paper on how to design PCBs for reiability given Pb'free 
  soldering. 
Werner 
 
-----Original 
  Message----- 
From: Hernefjord Ingemar <[log in to unmask]> 
To: 
  [log in to unmask] 
Sent: Mon, Nov 
  16, 2009 3:22 pm 
Subject: Re: [TN] Microvia reliability vs Lead 
  free 
 
 
 
any relationships are described, 
  one of which is a Curtiss-Wright report. They 
ave exposed identical 
  boards to SnPb soldering/repair and compared with same 
or SACs, and 
  found a significant difference in time to failure. 
 
  
  1st thermal cycle to failure 
  As Received 6 x 230 Celcius 6 x 
  260 
elcius 
Mean 788 443 4 
 
That is a 
  dramatic change in via failures. We have seen some failures 
  recently 
n ordinary double sided FR-4 boards, which were exposed to 
  several heat 
xposures in conjunction with electrical testing. Far 
  from 260 Celcius, think 
nly 125 Celcius. If we got microvia issues 
  with only 125 C, what if we use 260 
(e.g. repeated 
  repair)? 
Has anyone seen any signs of via failure due to increased 
  heat exposure 
  in 
ractice? 
 
nge 
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