Dave,
YES! That's it! Now I owe you another cold one. You must be up to at
least a 6-pack by now.
I cannot tell you how much I appreciate this. Thank you so much.
 
R. Dean Stadem
Consulting Engineer
Analog Technologies Corp./Lumagine, Inc.
11441 Rupp Drive
Burnsville, MN 55431
(952)894-9228
[log in to unmask]
 
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]

Sent: Friday, November 13, 2009 10:14 AM
To: Dean Stadem
Subject: Re: [TN] Damage to components from improper tinning
 

Hi Dean - were you thinking of this report: 



Dave 



Dean Stadem <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]> 
11/13/2009 10:10 AM 

Please respond to
[log in to unmask]

To
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cc
 

Subject
[TN] Damage to components from improper tinning
 

 
 



Dear Technet,
I thought I saw a link to a paper recently that was posted here on the
forum, but now I cannot find it. The paper I am looking for has to do
with reduction in component reliability due to thermal shock caused by
the component body coming in contact with solder during tinning, or
possibly during the soldering process. The paper talked about damage to
hermetic seals, internal reflow of the leadframe to the bonds, etc. If
anyone knows of such a paper, could you please let me know where I can
find it? It would be greatly appreciated.

R. Dean Stadem
Consulting Engineer
Analog Technologies Corp./Lumagine, Inc.
11441 Rupp Drive
Burnsville, MN 55431
(952)894-9228
[log in to unmask]


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