Dear Technet,
I thought I saw a link to a paper recently that was posted here on the
forum, but now I cannot find it. The paper I am looking for has to do
with reduction in component reliability due to thermal shock caused by
the component body coming in contact with solder during tinning, or
possibly during the soldering process. The paper talked about damage to
hermetic seals, internal reflow of the leadframe to the bonds, etc. If
anyone knows of such a paper, could you please let me know where I can
find it? It would be greatly appreciated.
 
R. Dean Stadem
Consulting Engineer
Analog Technologies Corp./Lumagine, Inc.
11441 Rupp Drive
Burnsville, MN 55431
(952)894-9228
[log in to unmask]
 

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