Which one? West Wing is out, probably cheap now. That soap kept me away at least.
Inge
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Glidden, Kevin
Sent: måndag 9 november 2009 15:49
To: [log in to unmask]
Subject: Re: [TN] NTC - [TN] Solder Voids in Chip Components
What a story! Have you tried hanging soap in a sack from the clothes line? The scent might keep him away....
-----Original Message-----
From: Stadem, Richard D. [mailto:[log in to unmask]]
Sent: Monday, November 09, 2009 9:40 AM
To: [log in to unmask]
Subject: Re: [TN] NTC - [TN] Solder Voids in Chip Components
Hi, Inge
The moose can indeed be a problem, the deer less so. I have a problem moose at my cabin. He likes to come around and rub his antlers on the clotheslines outside. He snaps them off, and I then need to replace them. So I replaced them with 1/8" solid metal cable, came back and found those snapped off also. I'm a little angry now, went to town and got 3/8" stranded cable. Wife woke me up because we heard a lot of thrashing and banging around about 6 a.m. one Saturday morning. We jumped up and looked outside just in time to see Bullwinkle walking into the woods, dragging both T-poles, cables and all behind him. Gave up on that, and went back to rope.
I washed out an empty paint can to use for collecting rain water under the downspout for our little garden up there, which we keep fenced in to keep the deer out. We even have chicken wire over the top. One afternoon we heard a loud bang! on the side of the house. Looking out the window, we saw a small buck running around in our yard with the paint can over its head. Apparently it liked the fresh water in the can, but because his antlers were just little nubs they snapped themselves inside the paint can and the little buck could not get its head out of the can. He was running around in the yard and violently shaking his head in an attempt to get the can off, and in the process was running into trees, the shed, the house, etc. I ran outside and tried to hold onto it while my wife tried to pull the can off, but we could not hang on long enough to pull it off. Then the d%$m deer ran into the lake and started swimming. So I jumped into the boat while my wife called the DNR and explained what was going on. I was able to catch up to the deer and hold its head above the water until the DNR came, put their boat into the water, and caught up. Between the three of us we were able to pry the can off of its head, pull the exhausted buck into the DNR boat, and bring it back to shore. It just laid there for about 10 minutes, then got up and ran away. Neighbor guy took pictures of the whole thing, and it made front page of the Ely Echo.
Never a dull moment up there. Never.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Saturday, November 07, 2009 3:21 PM
To: [log in to unmask]
Subject: Re: [TN] NTC - [TN] Solder Voids in Chip Components
Hi Dave,
here we use leadfree to, caliber 2 tons. Our cars. Hit a deer the other day, and my neighbour one deer yesterday. And today two moose calves passed our parking place. Mother moose was shot, becase she had just three legs.
Traffic incident. I've deers in my garden every night. Not happy with them, eat our flowers, and the moose massacres our fruit trees. Well,shouldn't complain, many kilos of meat from both in the freezer.
/Inge
----- Original Message -----
From: "David D. Hillman" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Saturday, November 07, 2009 10:04 PM
Subject: Re: [TN] NTC - [TN] Solder Voids in Chip Components
Hi Bev - yea, I know but its Saturday, the leadfree ballistics investigation on North American waterfowl was excellent today and I happened to log into TechNet since the football games were slow.
Dave
"Bev Christian" <[log in to unmask]>
11/07/2009 02:54 PM
To
<[log in to unmask]>, <[log in to unmask]> cc
Subject
Re: [TN] Solder Voids in Chip Components
Dave,
I was playing devil's advocate. That is what we use too for non-thermal ones. I am also an active member of the BTC committee.
Bev
RIM
----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Sat Nov 07 15:33:44 2009
Subject: Re: [TN] Solder Voids in Chip Components
Hi Bev - the void criteria for a QFN/LGA ground/thermal pad that we use is
50% maximum voiding unless the component has specific thermal or grounding
requirements impacted by voiding phenomena. The topic is also being discussed in the IPC BCT specification.
Dave Hillman
Rockwell Collins
[log in to unmask]
Bev Christian <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
11/07/2009 10:46 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to Bev Christian <[log in to unmask]>
To
[log in to unmask]
cc
Subject
Re: [TN] Solder Voids in Chip Components
Inge,
You get to play with the weirdest stuff! I was referring to "normal"
cases.
Something more down to earth though is voiding in LGA/QFN central thermal pads. What do people allow for that?
Bev
RIM
----- Original Message -----
From: Inge <[log in to unmask]>
To: TechNet E-Mail Forum <[log in to unmask]>; Bev Christian
Sent: Sat Nov 07 11:41:15 2009
Subject: Re: [TN] Solder Voids in Chip Components
There is an exception, namely when you have to do with high power chips.
We
mounted HexFets that disspated 200 Watts, and those with too much voids simply burnt.
By the way, I got no answer from Kevin about how to planarize heat via solder fills. Anyone?
/Inge
----- Original Message -----
From: "Bev Christian" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Saturday, November 07, 2009 5:10 PM
Subject: Re: [TN] Solder Voids in Chip Components
Correct. Or the voids are open to the surface, as Joyce K pointed out to me.
Bev
----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Sat Nov 07 11:02:58 2009
Subject: Re: [TN] Solder Voids in Chip Components
Unless there is a significant "segregation" of rather small voids at one of the interfaces :-)
Vladimir
SENTEC
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
-----Original Message-----
From: Bev Christian <[log in to unmask]>
Date: Sat, 7 Nov 2009 10:59:31
To: <[log in to unmask]>
Subject: Re: [TN] Solder Voids in Chip Components
Alejandro,
No there is not.
In the 10 years I was at Nortel we could never see any significant difference between shear strength of solder joints with low voiding and those that looked like Swiss cheese (up to 50% voiding). I am sure that Werner will come back and rightly say that shear strength does not necessarily equate to solder joint reliability. But I can say we never saw
chip cap problems that were traceable to the joint voids.
Bev
----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Sat Nov 07 10:40:25 2009
Subject: [TN] Solder Voids in Chip Components
Hello,
Does anybody know if there is an IPC specification that describes the amount of solder voids allowed in a chip component solder joint? The IPC-A-610 Rev D is specific describing the % of voids allowed for BGA's solder joints
(<25%) only but not for any other type of components.
Saludos Cordiales / Best Regards
Alejandro A. Domínguez
Robert Bosch Corporation
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