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Subject:	Re: Preparing for microvia examination
From:	Steven Creswick <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Steven Creswick <[log in to unmask]>
Date:	Thu, 26 Nov 2009 16:16:32 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (200 lines)
Now you both have me confused!

I think I will resume eating turkey, dressing, and cranberry sauce!

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Thursday, November 26, 2009 4:03 PM
To: [log in to unmask]
Subject: Re: [TN] Preparing for microvia examination

Schrekxscht ?



----- Original Message ----- 
From: "Joyce Koo" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, November 26, 2009 7:40 PM
Subject: Re: [TN] Preparing for microvia examination


Yap.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick
Sent: Thursday, November 26, 2009 12:56 PM
To: [log in to unmask]
Subject: Re: [TN] Preparing for microvia examination

Joyce,

Do you think this is related to the grinding/thinning process, or the
package structure that the thinned device is subsequently placed into?

Happy Thanksgiving day to US

Steve C

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Wednesday, November 25, 2009 11:19 AM
To: [log in to unmask]
Subject: Re: [TN] Preparing for microvia examination

Yes.  Specially, thined die.
--------------------------
Sent using BlackBerry


----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Wed Nov 25 11:03:09 2009
Subject: [TN] Preparing for microvia examination

Schrekxscht!
That was the way the aliens from planet Mars saluted us in the funny
film
that ended in their heads exploding when a guy played Elvis Presley on
his
car radio. What does that have to do with microvias?  Anyone with
experience
from cutting a board into small pieces and mold them in epoxy for cross
section analysis? I use a thin blade, high rpm diamond blade for
cutting.
The board was equipped with SuperBGAs down to smallest QFNs. We
suspected
via problems and looked for such after polishing. In fact we found
extremly
good barrels and no sign of via issues. Instead we saw that some
cross-sectioned semi chips had fine microcracks. In some cases, the
microcrack ran all the way across the chip, i.e. the whole active area
was
more or less separated from the rest of the chip.My q is this:  has
anyone
of you got microcracks in the semi chips caused during the cutting
operation? I,ve cross sectioned hundreds of boards during my time here,
but
never seen cracks like these be caused by the diamond cutting. Can there
be
a Schrekxscht when you use the diamond saw?
/Inge

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