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| Date: | Wed, 25 Nov 2009 11:19:09 -0500 |
| Content-Type: | text/plain |
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Yes. Specially, thined die.
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----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Wed Nov 25 11:03:09 2009
Subject: [TN] Preparing for microvia examination
Schrekxscht!
That was the way the aliens from planet Mars saluted us in the funny film
that ended in their heads exploding when a guy played Elvis Presley on his
car radio. What does that have to do with microvias? Anyone with experience
from cutting a board into small pieces and mold them in epoxy for cross
section analysis? I use a thin blade, high rpm diamond blade for cutting.
The board was equipped with SuperBGAs down to smallest QFNs. We suspected
via problems and looked for such after polishing. In fact we found extremly
good barrels and no sign of via issues. Instead we saw that some
cross-sectioned semi chips had fine microcracks. In some cases, the
microcrack ran all the way across the chip, i.e. the whole active area was
more or less separated from the rest of the chip.My q is this: has anyone
of you got microcracks in the semi chips caused during the cutting
operation? I,ve cross sectioned hundreds of boards during my time here, but
never seen cracks like these be caused by the diamond cutting. Can there be
a Schrekxscht when you use the diamond saw?
/Inge
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