That's the one!
I was assuming that Paymon's question related to parts that have been
removed form their hermetic packaging and that moisture uptake may well
then be the limiting factor in how long the components can be used for
without re baking.
Mumtaz Bora wrote:
> Hello Eric,
>
>
> For moisture sensitive package handling, storage ,packaging and floor
> life after opening bags, please refer to J-STD-033B.1 .
>
> Please go to www.jedec.org to view the standard.
>
>
>
>
> Mumtaz Bora
>
> Senior Quality Engineer
>
> Peregrine Semiconductor
>
> 9380 Carroll Park Drive
>
> San Diego, CA 92121
>
> 858-795-0112-direct
>
> 858-731-9499 -fax
>
> [log in to unmask]
>
> SMTAI, October 6-7, 2009 in San Diego, CA - a world-class conference
> and exhibition devoted to electronics assembly. Visit
> www.smta.org/smtai for full details.
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>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Eric CHRISTISON
> Sent: Wednesday, November 04, 2009 7:34 AM
> To: [log in to unmask]
> Subject: Re: [TN] Component Shelf Life
>
> What about moisure sensitivity? I'm thinking about MSL classifications
> which are outlines in a Jedec spec which I can't lay my hands on right
> now? A bit of a vague question.
>
> Regards,
>
>
>
> Bev Christian wrote:
>
>> Paymon,
>> Gregg hit it on the nail head.
>>
>> In addition, it is going to depend on finish, finish thickness
>> (varies) and what your level of acceptability is (which IPC class
>> product do you build?).
>>
>> I also do not know of a published, recent standard on this topic.
>> Bev
>> RIM
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Paymon Sani
>> Sent: Wednesday, November 04, 2009 9:54 AM
>> To: [log in to unmask]
>> Subject: [TN] Component Shelf Life
>>
>> Dear Colleagues,
>>
>> I am looking for a standard for component shelf life. Is anyone aware
>> of such document?
>>
>> Best Regards,
>>
>> Paymon Sani
>> Quality Engineer
>> Creation Technologies
>>
>> Office: 905.754.5000 x 5363
>> 110 Clegg Road | Markham, ON, Canada | L6G 1E1
>> [log in to unmask]<mailto:[log in to unmask]> |
>> www.creationtech.com<http://www.creationtech.com/>
>>
>> [cid:[log in to unmask]]Working together to build the
>> future
>>
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>
> --
> Eric Christison Msc
> Mechanical Engineer
> Consumer & Micro group
> Imaging Division
>
> STMicroelectronics (R&D) Ltd
> 33 Pinkhill
> Edinburgh EH12 7BF
> United Kingdom
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--
Eric Christison Msc
Mechanical Engineer
Consumer & Micro group
Imaging Division
STMicroelectronics (R&D) Ltd
33 Pinkhill
Edinburgh EH12 7BF
United Kingdom
Tel: +44 (0)131 336 6165
Fax: + 44 (0)131 336 6001
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