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If there's no reason to do otherwise, I use the stackup that Sunstone / PCB Express uses:
4-Layer Construction:
Layer Stack-up:
1 copper foil, .0007 (1/2 ounce)*
.010 - .014 glass
2 copper clad, .0014 (1 ounce)
.026 - .028 glass
3 copper clad, .0014 (1 ounce)
.010 - 014 glass
4 copper foil, .0007 (1/2 ounce)*
You can find info on Sunstone's standard board here: http://www.pcbexpress.com/technical/faq.php
-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Brooks, Bill
Sent: Wednesday, November 04, 2009 12:20 PM
To: [log in to unmask]
Subject: [DC] Standard construction for a 4 layer board...
I need to ask the designers and particularly the manufacturers a
question.
IS there a standard construction for a 4 layer FR4 board?
What thickness core and what prepreg arrangement would be used if I
asked for a IPC 4101/26 material to be used without specifying the
stackup thicknesses?
Best regards,
Bill Brooks | Datron World Communications, Inc.
PCB Designer/Engineer | Office: 760-602-7004| Fax: 760-597-3777 |
[log in to unmask]
1808 Aston Avenue, Suite 230, Carlsbad, CA 92008 | www.dtwc.com
Performance You Require. Value You ExpectTM
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