Hi Eli,

(sorry this is a general answer)

I've seen this kind of problem on similar packages.
Check the solderpaste deposit volume.
Is it constant?
Perhaps overprinting will help you in controlling the amount of
solderpaste and  helps to get rid of the fractures/opens.
Because of the pitch there should be enough room for overprinting.

It is hard to solve a problem if the cause is not fully understood.
In order to completely understand the problem you need a cross section.
My guess is a stencilprinting or handling issue.


Jowan

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eli Sarig
Sent: Monday, October 12, 2009 8:05 PM
To: [log in to unmask]
Subject: EASYBGA solderjoints problems

Hi all,

Recently, we get disconnections within INTEL easyBGA flash component.
When
pressing down, it is working again.
It is 40 mil" pitch, but the ball size is only 16 mil". The pad should
be
around 12 to 14 mil", which is relatively small for that pitch.
Dose anyone experienced that problem with easyBGA's? I am not looking
for a
general answer regarding BGA disconnection failure, but for specific
reason
regarding easyBGA package.
Thanks.

Eli.

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