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Subject:	Re: TinLead Plated component effect on Lead Free solder joint reliability?
From:	Vladimir Igoshev <[log in to unmask]>
Reply To:	[log in to unmask]
Date:	Thu, 1 Oct 2009 16:51:37 +0000
Content-Type:	text/plain
Parts/Attachments:	text/plain (1 lines)

If Pb- is evenly dispersed throughout the bulk of solder - shouldn't be any.



Regards,



Vladimir

SENTEC

------Original Message------

From: Maurice DORE

Sender: TechNet

To: [log in to unmask]

ReplyTo: TechNet E-Mail Forum

ReplyTo: Maurice DORE

Sent: Oct 1, 2009 12:25

Subject: [TN] TinLead Plated component effect on Lead Free solder joint reliability?



Hi all

I have a Tin Lead component that I need to use in a Lead Free process (ELV).

What are the concerns with the small quantity of lead (Pb) from the plating

in the SAC solder joint?



I am concerned about the metallurgy side (leaded component materials e.g.

mold compound are LF process compliant) - will the lead content increase the

possibility of secondary reflow due to a low temperature phase or any other

reliability issues.





Thanks in advance

Moss



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