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October 2009

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Subject:
Re: IPC Document # for solder float test
From:
"Carroll, Thomas A" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Carroll, Thomas A
Date:
Thu, 8 Oct 2009 06:50:48 -0700
Content-Type:
text/plain
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text/plain (45 lines) 
Craig,

Look at IPC-TM-650 2.6.8 - Thermal Stress, Plated-Through Holes.

Regards,
Tom Carroll, CQA, CIT
Supplier Quality Engineer
Boeing Integrated Defense Systems - East Region Supplier Quality
Home Office Phone/FAX: 845-753-5932
Temp Office Phone at Alabama Aircraft Indus Inc (205) 510-4783
Temp Office FAX at AAII (205) 592-0295
Boeing Cell: 215-692-2463
email: [log in to unmask]

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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Craig Sullivan
Sent: Thursday, October 08, 2009 8:17 AM
To: [log in to unmask]
Subject: [TN] IPC Document # for solder float test

Hi, 

I'm still looking, but can anyone tell me the IPC document number for a solder float test (test method) at bare board level?

Thanks,
Craig

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