Do not reflow them.

Remove, replace with a new device, bake and reball the old one, inspect it,
re-test (if practical) and then let your MRB decide what to do with it
depending on what it is going into i.e. re-use, scrap et.




John Burke
(408) 515 4992


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Blair Hogg
Sent: Wednesday, October 07, 2009 5:20 AM
To: [log in to unmask]
Subject: Re: [TN] BGA X-Ray Defect Detection Capabilities

Just out of curiosity, when you detect an open on a BGA, what do you do? I'm
suspecting it is not practical to rework just the open sj, can you reflow
the entire BGA to get the open sj to form a connection, or remove and
reattach? 
Do you re-use the removed device or replace with a new one? 

Is the x-ray inspection really useful, or is it just to confirm a defect
found in test? Or does it detect defects before test so that they can be
reworked prior to testing?

Is the x-ray inspection useful for getting the profile parameters correct,
and then once the process is in control the inspection no longer adds value?

Thanks,

Blair

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